Method and structure for a wafer level packaging

ABSTRACT

A method and structure for a wafer level package is provided, which utilizes a plurality of spacer walls on a semiconductor wafer or a transparent substrate, which has the ability to decide the position of the sealant. As a result, the dimension of a device is decided by the position of the sealant and the spacer walls, therefore, shrinking the distance between the photosensitive zone and the sealant will enhance the gross dies after performing a die sawing process to the whole semiconductor wafer. In addition, the semiconductor process decides the height of the spacer walls so that the yield will be improved due to the fact that a uniformity of the gap, which is between the semiconductor wafer and the transparent substrate, and the width of sealant, will be controlled.

This application is a division of prior application Ser. No. 10/680,434filed Oct. 8, 2003.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a wafer level packaging, and morespecifically to form spacer walls and sealant on a wafer or transparentsubstrate at a wafer level package.

2. Description of the Prior Art

In recent years, since the circuit devices in a chip are manufacturedwith a high density, the IC package is also developed to high density,high efficiency and miniaturization. Typically, the packaging canprotect the dies from moisture and mechanical damage. In the technology,the semiconductor dies or chips are usually individually packaged in aplastic or ceramic package after accomplishing wafer fabrication. Thefunction of the packaging includes power distribution, signaldistribution, heat dissipation, protection and support. As a result, thepackaging technique is influenced by the development of integratedcircuits, and the trend in electrical products is to have highintegration with a small size. Therefore, the integrated circuits willbe minimized so that the logic circuits within a chip or die are greatlyenhanced, and the input/output (I/O) pins are also increased. In orderto coordinate with the requirements and alterations as above, varioustypes of packaging have recently been developed, for instance ball gridarray (BGA), chip scale package (CSP), multi chip module package (MCMpackage), tape carrier package (TCP) and wafer level package (WLP) etc.

No matter what type of packaging, most of the packaging is divided intoindividual chips before they are packaged. However, the packaging at thewafer level is a trend in semiconductor packaging. Typically, the waferlevel package utilizes the whole wafer as an object, not utilizing asingle chip or die. Hence, before performing a scribing process,packaging and testing must be accomplished. This is an advancedtechnique so that the process of wire bonding, mold, die mount andassembly can be omitted so do lead frame and substrate. Therefore, thecost and manufacturing time will be reduced. On the other hand, theprocess in traditional packaging includes, die saw, die mount, wirebond, mold, trim, mark, plating and inspection etc.

A conventional packaging will be described with reference to FIG. 1A to1C. Referring to FIG. 1A, providing a semiconductor wafer 101 and atransparent substrate 113 firstly, the semiconductor wafer 101 comprisespluralities of dies 103 thereon, further, the pluralities of dies 103utilize the semiconductor processes so as to manufacture pluralities ofmicrocircuits thereof (not illustrated). Next, referring to FIG. 1B,each of the dies 103 on the semiconductor wafer 101 is individuallyseparated by a dicing saw machine so that a plurality of individual dies103 is obtained. Then, the individual dies 103 are placed on asemiconductor wafer 105 by a pick and place arm of a die bonder and thenadhered by an epoxy (not illustrated). The semiconductor substrate 105comprises borders 107, wherein the borders 107 are obtained from a moldwith a particular pattern and the semiconductor process. As a result,each individual chip 103 is placed on the semiconductor substrate 105 bya die bonder in the process of a die mount. Thus, the individual dies103 are easily dropped, resulting in the gross amount of semiconductorwafer 101 dies are greatly reduced, moreover; the yield will bedecreased. Thereafter, performing a process of wire bonding in order totransfer the signal from the individual dies 103 to the outside. Theprocess of wire bonding comprises, gold bonding wire 109 wire bonds onthe individual dies 103.

Subsequently, as shown in FIG. 1C, after adhering and placing eachindividual dies 103 on the semiconductor substrate 105, performing aprocess of mold, wherein a sealant 111 is coated on the borders 107 andthen a transparent substrate 113 is covered thereon.

Another process of the sealant is refereed to TFT-LCD process, whereinthe spacer balls (not illustrated) are randomly mixed with the sealant111. The function of the sealant 111 is that the upper substrate of theliquid crystal pannel can adhere compactly with lower one, more,isolating the liquid crystal from the outside. The spacer balls areprovided as a support between the upper substrate and the lowersubstrate. However, the spacer balls have become spheroids while thetransparent substrate 113 is a cover. Also, the spacer walls shape isnot regular so that the width of the sealant 111 is hard to control,further; the uniformity of the gap, which is between the upper substrateand the lower substrate, is not able to be maintained. Hence, theelectric field is variously distributed so that the gray level of theliquid crystal is influenced. Due to the fact that the sealant 111 is apolymer material, it is accessible to have reactions with the liquidcrystal, even overflow to a sensor area, which has a die 103. In orderto have a safe distance between the sealant 111 and the sensor area, thedimension of the device is not simple to shrink so that the gross diesof a wafer will be decreased, more, the yield is also not improved.

By the processes of the traditional packaging or TFT-LCD process asmentioned above, the position and width of the sealant are not to beprecisely and effectively controlled. Therefore, an improved method ofpackaging is required in order to overcome the problems of the packagingin the prior art.

SUMMARY OF THE INVENTION

It is an objective of the present invention to provide a method andstructure for wafer level packaging that utilizes the semiconductorprocess to form the spacer walls. The position of the sealant and thescope can be precisely decided by placing the sealant beside the inneror outer side wall of the spacer walls. Hence, the distance between thesealant and the photosensitive zone will be reduced so that the grossamount of wafer dies will be improved, moreover; the throughput will beincreased.

It is another objective of the present invention to provide a method andstructure for a wafer level packaging that utilizes the semiconductorprocess to form the spacer walls. The uniformity of the gap, which isbetween the semiconductor wafer and transparent substrate, will beefficiency maintained by controlling the height of the spacer walls.Further, the spacer walls will control the stability and width of thesealant when the semiconductor wafer is covering and adhering to thetransparent substrate. Therefore, the yield will be increased.

It is further objective of the present invention to provide a method andstructure for a wafer level packaging that utilizes the semiconductorprocess to form the spacer walls. Hence, the spacer walls caneffectively dissipate any heat and protect the die from damage caused bymoisture, and the heat from the interior is effectively dissipated tothe outside after the semiconductor wafer is covered and adhered on tothe transparent substrate.

It is still a further objective of the present invention to provide amethod and structure for a wafer level packaging, wherein a scribingprocess is performed after the wafer and the transparent substrate areadhered. Therefore, any contamination from particles or the dies isgreatly reduced. Therefore, the yield will be improved.

According to a preferred embodiment of the present invention, a methodand structure for a wafer level packaging is provided. At first, asemiconductor wafer and a transparent substrate are provided, whereinthe semiconductors wafer comprises pluralities of dies thereon.Moreover, pluralities of microcircuits are manufactured on thepluralities of dies by a semiconductor process. The semiconductor wafercomprises silicon or other semiconductor materials, for instance GaAs orInP. The pluralities of dies, which are on the semiconductor wafer,include a photosensitive device. Furthermore, the transparent substratecomprises glass or quartz with a thin film thereof, for instance ananti-reflection (AR) layer, a conductive layer with indium tin oxide(ITO), a UV cut layer or a IR cut layer. Then, a dielectric layer isdeposited on the transparent substrate, for instance a silicon oxidelayer, a silicon nitride layer or a polymer layer, wherein the polymerfilm comprises polyimide. Next, a photoresist layer is deposited on thedielectric layer and then a photolithography process is performed on thephotoresist layer in order to expose the dielectric layer. Followingthat, the photoresist layer is utilized as a mask in order to perform anetching process to the dielectric layer. Finally, the photoresist layeris stripped so as to form a plurality of spacer walls, which comprise adielectric layer on the transparent substrate. The position and shape ofthe spacer walls correspond to the position and shape of the pluralitiesof the dies, which are on the semiconductor wafer. The dimensions of thespacer walls are slightly smaller than the spacer walls, and the shapecould be that of an arm figure. Besides, the position could be onopposite sites or surrounded on four sides to form a square or rectanglefigure, or an L-figure.

As mentioned above, the photolithography process utilizes thepluralities of dies, which are on the semiconductor wafer, as thereferable pattern. Then, an auto sealant machine coats a sealant ofepoxy adhesive, UV adhesive or thermoplastic adhesive, which joins theinner or outer side wall of the spacer walls. The semiconductor wafer isthen covered by a transparent substrate; further, the pluralities ofdies and the plurality of spacer walls, which are on the transparentsubstrate, are aligned. Finally, the process of the packaging issuccessively accomplished.

The wafer level packaging process is not limited to the methods andstructures mentioned above. One way is to form both the spacer walls andthe sealant on the semiconductor wafer. Another way is to form thespacer walls on the semiconductor wafer or transparent substrate, butform the sealant on the relative semiconductor wafer or transparentsubstrate and then perform the same processes as in the foregoingarticle in the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The objectives and features of the present inventions as well asadvantages thereof will become apparent from the following detaileddescription, considered in conjunction with the accompanying drawings.It is to be understood, however, that the drawings, which are not toscale, are designed for the purpose of illustration and not as adefinition of the limits of the invention, for which reference should bemade to the appended claims.

The present invention can be the best understood through the followingdescription and accompanying drawings, wherein:

FIG. 1A to 1C shows schematically cross-sectional views of various stepsof a conventional method for the packaging process;

FIG. 2A to 2F shows schematically cross-sectional views of various stepsof the present invention that a method and structure for a wafer levelpackaging according to one embodiment of the present invention, whereinthe spacer walls are formed on a transparent substrate; and

FIG. 3A to 3E shows schematically cross-sectional views of various stepsof the present invention that a method and structure for a wafer levelpackaging according to one embodiment of the present invention, whereinthe spacer walls are formed on a semiconductor wafer.

DESCRIPTION OF THE PREFERRED EMBODIMENT

The first preferred embodiment of this invention is explained withreference to the drawings of FIG. 2A to 2F. Referring to FIG. 2A;firstly, providing a semiconductor wafer 200 and a transparent substrate203 respectively, wherein the semiconductor wafer 200 is formed by asemiconductor material, for instance silicon, GaAs or InP etc. Each ofsemiconductor wafers 200 includes pluralities of dies 201 adjoined toeach other, which have a suitable shape, for instance a rectangular orsquare. The pluralities of dies 201 comprise a photosensitive device,for instance a CMOS image sensor, liquid crystal on silicon (LcoS) or acharge coupled device (CCD) etc. That is, each die 201 has aphotosensitive zone (with reference to numeral 202 illustrated in FIG.2E). In addition, the pluralities of dies 201 comprise a plurality offabricated microcircuits (not illustrated). Furthermore, each of thepluralities of dies 201 having a plurality of bonding pads 201A such asaluminum pads, which are deposited on one side or both opposite sidesthereof (across from each other), in order to provide the connectionpoints with other substrates after performing a scribing process. Thebonding pads 201A utilize the method of chemical vapor deposition (CVD)or physical vapor deposition (PVD) for deposit. Besides, the transparentsubstrate 203 comprises a thin film 203A, for instance an ITO layer withexcellent conductivity properties, an anti-reflection layer, a UV cutlayer or a IR cut layer.

Thereafter, referring to FIG. 2B, providing a transparent substrate 203firstly, for instance quartz or a glass. The transparent substrate 203comprises a thin film 203A thereof. Then, a dielectric layer 205 isdeposited on the thin film 203A, wherein the material of dielectriclayer 205 could be silicon oxide, silicon nitride or a polymer film (forinstance polyimide). The dielectric layer 205 can utilize the method ofCVD for deposit.

Following, as shown in FIG. 2C, a photoresist layer 207 is coated on thedielectric layer 205 and then the spacer walls 209 are formed on thesurface of the transparent substrate 203 by using the exposure,photolithography and etching processes. The formation of spacer walls209 utilizes the following process: firstly performing an exposingprocess in order to transfer a mask (not illustrated) with a particularpattern to the photoresist layer 207 by the way of pattern transfer.Then, the post exposure baking process is performed on the exposedphotoresist layer 207 in order to reduce the standing wave phenomenon.Next, performing a photolithography process that exposed the photoresistlayer 207 is stripped in order to expose the portion of dielectric layer205. Then, utilizing the unexposed photoresist layer 207 as a mask toremove the exposed dielectric layer 205 and the thin film 203A, which isunder the dielectric layer 205. That is, a method of wet etching or dryetching is utilized, for instance hydrofluoric acid (HF) of the wetetching method, plasma etching or reactive ion etch (RIE) of the dryetching method. Finally, the unexposed photoresist layer 207 is strippedin order to form the spacer walls 209 on the transparent substrate 203,as shown in FIG. 2D. The spacer walls 209 comprise a dielectric layer205 and the thin film 203A, and the height of the spacer walls 209 isdecided by the material of the spacer walls 209. The height is typicallyfrom 0.1 to several ten micrometers.

Furthermore, the position, shape and dimension of each spacer walls 209correspond to the shape, position and dimension of the photosensitivezone 202 of the dies 201. Further, the position, shape and dimension ofthe spacer walls 209 correspond to the shape, location and dimension ofthe dies 201. In one embodiment of the present invention, the spacerwalls 209 can have an arm shape or an arm shape with the plurality ofindividual, continuous or partially continuous spacer wall units. Theposition of the spacer walls 209 with an arm shape can refer to theposition of the die 201 and place them on opposite sites thereon, more;a dimension is smaller than a length of the one die. In anotherembodiment, the shape of spacer wall 209 is similar to the shape of onedie, and the photosensitive area, which is located on the die. Besides,a dimension is smaller than the perimeter of the one die so as to have alittle pitch for using. It is noted that the shape, position anddimension of the spacer walls 209 as mentioned above do not limit thescope of the present invention. Those that can be manufactured bylithography methods are used to balance and support the distance betweenthe transparent substrate 203 and dies, such as L shape, which isincluded with the scope of the present invention.

Subsequently, referring to FIG. 2E, using sealant 211 as coating, whichthe width is smaller than 1000 micrometers and the height is smallerthan 200 micrometers, beside the inner or outer side wall of the spacerwalls 209 by a auto sealant machine. The material of the sealant 211could be epoxy adhesive, UV adhesive or thermo-plastic adhesive etc.More, the material of the sealant 211 is decided in conjunction with thematerial of the spacer walls 209. When the polymer film is utilized asthe material of spacer walls 209, for instance polyimide, the UVadhesive could be used because of fast curing rate and thecharacteristic of nonheating. However, when the oxide or nitride film isutilized as the material of the spacer walls 209, any material ofsealant as above-mention could be used.

As a result, the position of each spacer walls 209 is determinedaccording to each dimension of dies 201 or the photosensitive zone 202of the dies 201 . More, the sealant 211 adjoins the inner or outer sidewall of each spacer wall 209, the position of the sealant 211 could becontrolled. Therefore, the distance between the sealant 211 to thesensor area (photosensitive zone 202) of a die 201 could be shrunk sothat the gross dies of a wafer could be improved. Hence, the throughputis increased. Subsequently, a curing step is performed to the sealant211, for instance the UV radiation or thermal process to harden thesealant is used. Then, a grinding process, which is optional, is used togrind the sealant 211 on the transparent substrate 203. Following that,the semiconductor wafer 200, which comprises pluralities of dies 201, iscovered on the transparent substrate 203 and aligned on the pluralitiesof spacer walls 209 of the transparent substrate 203. Hence, each of thedies 201 is placed between two spacer walls 209. Then, the semiconductorwafer 200 is adhered to the transparent substrate 203 by the sealant211. Finally, this present invention is successively accomplished.

Due to the fact that the spacer walls 209 are formed in thesemiconductor process, the height and uniformity can be preciselycontrolled. Hence, when the semiconductor wafer is covering and adheringto the transparent substrate, the uniformity of gap, which is betweenthe semiconductor wafer and the transparent substrate, could becontrolled. Also, the stability of the sealant could be controlled;therefore, the yield is improved. Further, this method does not needtraditional spacer balls to mix with the sealant; therefore, the overallprocess will be reduced. Also, it can prevent the overflow of spacerballs into the photosensitive zone so that the distance between thesealant and photosensitive zone does not need a safety range; therefore,the throughput is improved.

After accomplishing this invention of a wafer level packaging, utilizingthe spacer walls 209 as a scribe line and performing a scribing process,for instance a laser saw, wafer saw etc. In the scribing process,utilizing the whole wafer as an object in order to obtain pluralities ofindividual dies 201. Further, having pluralities of bonding pads 201Adeposited on one side or both opposite sides so as to form theconnecting points with the outside, wherein performing a way of cuttingaskew in order to expose the bonding pads 201A. As a result, the presentinvention performs a scribing process after accomplishing the packagingfor the semiconductor wafer 200. Therefore, the manufacturing time canbe reduced, also; the opportunity of dropping the dies and thecontamination of particles on the dies is greatly reduced, and the yieldis improved.

FIG. 2F is an assistant illustration to FIG. 2E that a situation for thesemiconductor wafer 200 adheres with the transparent substrate 203.

The second preferred embodiment of this invention could be explainedwith reference to the drawings of FIG. 3A to 3E. Referring to FIG. 3Afirstly, providing a semiconductor wafer 300 and a transparent substrate303 respectively, wherein the semiconductor wafer 300 comprises asemiconductor material, for instance silicon, GaAs or InP etc. Each ofsemiconductor wafers 300 comprises pluralities of dies 301 that have thesuitable shape and adjoin to each another, for instance rectangularshape or square shape. Each of pluralities of dies 301 comprises aphotosensitive device, for instance CMOS image sensor, liquid crystal onsilicon (LcoS), charge coupled device (CCD) etc. That is, each die 301has a photosensitive zone 302. In addition, the pluralities of dies 301comprise a plurality of fabricated microcircuits (not illustrated).Furthermore, each of the pluralities of dies has a plurality of bondingpads 301A, for instance aluminum pads, and depositing on the one side oropposite sides thereof that provide the connection points with othersubstrates after a scribing process is performed. The bonding pads 301Autilizes the method of chemical vapor deposition (CVD) or physical vapordeposition (PVD) for deposit. Besides, the transparent substrate 303comprises a thin film 303A, for instance an ITO layer with the propertyof excellent conductivity, an anti-reflection layer, a UV cut layer or aIR cut layer.

Subsequently, referring to FIG. 3B, a dielectric layer 305 is depositedon the semiconductor wafer 300, wherein the semiconductor wafer 300comprises pluralities of dies 301 thereon. The material of thedielectric layer 305 could be silicon oxide, silicon nitride or apolymer film (such as polyimide). Next, a photoresist layer 307 iscoated on the dielectric layer 305, more; the dielectric layer 305 andthe photoresist layer 307 utilizes the method of CVD for deposit.

After depositing a photoresist layer 307 on the dielectric layer 305,sequentially, as shown in FIG. 3C, utilizing the exposure,photolithography and etching processes to form the spacer walls 309 onthe surface of the dies 301 of the semiconductor wafer 300. Theformation of the spacer walls 309 utilizes the processes as follows: atfirst, performing a photolithography process in order to transfer a mask(not illustrated) with a particular pattern to the photoresist layer 307by the way of the pattern transfer. Then, the process of post exposurebaking is performed on the exposed photoresist layer 307 in order toreduce the standing wave phenomenon. Next, performing a photolithographyprocess that exposes the photoresist layer 307 is stripped in order toexpose the portion of the dielectric layer 305. Then, utilizing theunexposed photoresist layer 307 as a mask in order to remove the exposeddielectric layer 305, wherein a method of wet etching or dry etching isutilized, for instance hydrofluoric acid (HF) of wet etching method,plasma etching or reactive ion etch (RIE) of dry etching method.Finally, after stripping the unexposed photoresist layer 307, the spacewalls 309 are formed on each of the pluralities of dies 301 ofsemiconductor wafer 300, for instance, placed on the opposite sites. Thespacer walls 309 comprise dielectric layer 305, and the height of spacerwalls 309 is decided by the material of spacer walls 309 that is used.The height is typically from 0.1 to several ten micrometers.

Furthermore, the position, shape and dimension of each spacer wall 309correspond to the shape, position and dimension of the photosensitivezone 302 of the dies 301. Further, the position, shape and dimension ofthe spacer walls 309 correspond to the shape, position and dimension ofthe dies 301. In one embodiment of the present invention, the spacerwalls 309 have an arm shape or have an arm shape with the plurality ofindividual, continuous or partially continuous spacer wall units. Theposition of the spacer walls 309 with an arm shape can refer to theposition of the die 301 and placing to the opposite sites thereon,furthermore; the dimension is smaller than the length of one die. Inanother embodiment, the shape of one spacer walls 309 is similar to theshape of one die, and has a dimension smaller than the perimeter of onedie so as to have a little pitch for using. It is noted that theseembodiments mentioned above do not limit the scope of the presentinvention. Those that can be manufactured by lithography methods areused to balance and support the distance between the transparentsubstrate 303 and dies, such as L shape, which is included with thescope of the present invention.

Subsequently, referring to FIG. 3D, using the sealant 311 as coating,which the width is smaller than 1000 micrometers and the height issmaller than 200 micrometers. Beside the inner or outer side wall of thespacer walls 309 by a auto sealant machine. The material of the sealant311 could be an epoxy adhesive, UV adhesive or thermoplastic adhesiveetc. More, the material of the sealant 311 is decided in conjunctionwith the material of the spacer walls 309. When the polymer film isutilized as the material of the spacer walls 309, for instancepolyimide, the UV adhesive could be used because of fast curing rate andthe characteristic of nonheating. However, when the oxide or the nitridefilm is utilized as the material of spacer walls 309, any material ofsealant as mention above could be used.

As a result, the position of the spacer walls 309 is determinedaccording to the dimension of each of the dies 301, and the sealant 311adjoining to the inner side wall or outer side wall of the spacer walls309. Therefore, the position of sealant 311 could be controlled, and thedistance between the sealant 311 to the photosensitive zone 301, of adie 301, could be effectively reduced. Hence, the gross dies of a wafercould be improved and the throughput is increased. Subsequently, acuring step is performed for the sealant 311, for instance the UVradiation or thermal process to harden the sealant. Then, a grindingprocess, which is optional, is used to grind the sealant 311 on thesemiconductor wafer 300. Following that, a transparent substrate 303which comprises a thin film 303A, covers the semiconductor wafer 300 andis aligned with the pluralities of spacer walls 309 of semiconductorwafer 300. Hence, each of the dies 301 is placed between two spacerwalls 309 and then the semiconductor wafer 300 is adhered with thetransparent substrate 303 by sealant 311. Finally, this presentinvention is successively accomplished. Due to the fact that the spacerwalls 309 are formed with the semiconductor process, the height anduniformity can be precisely controlled. Hence, when the semiconductorwafer is covering and adhering with the transparent substrate, theuniformity of gaps, which are between the semiconductor wafer andtransparent substrate, could be controlled. In addition, the stabilityof the sealant could be also controlled; therefore, the yield isimproved. Further, this method does not need traditional spacer balls tomix with the sealant 311; therefore, the process will be reduced. Also,it can prevent the spacer balls overflow into the photosensitive zone sothat the distance between the sealant and photosensitive zone does notneed a safety range; therefore, the throughput is improved.

Next, in accordance with the present invention of wafer level packaging,utilizing the spacer walls 309 as a scribe line and performing ascribing process, for instance a laser saw, wafer saw etc. In thescribing process, utilizing the whole wafer as an object in order toobtain pluralities of individual dies 301. More, on the one side oropposite sides a plurality of bonding pads 301A are deposited thereonand then performing a way of cutting askew in order to expose thebonding pads 301A as a connecting point with the outsides. As a result,the present invention that performs a scribing process afteraccomplishing the packaging for the semiconductor wafer 300. Therefore,the manufacturing time can be reduced, moreover; the opportunity in thedropping of dies and the contamination from particles on the dies isgreatly reduced, and the yield is improved.

FIG. 3E is an assistant illustration to FIG. 3D that a situation for thesemiconductor wafer 300 is covered and adhered to the transparentsubstrate 303.

In accordance with the first and second embodiment of this invention,the other embodiments will be also performed. For instance, the spacerwalls could be formed on a semiconductor wafer or transparent substraterespectively. The sealant is coated on another relative semiconductor ortransparent substrate. Then, a scribing process will be performed inorder to obtain the individual die, which is already accomplished in thepackaging process.

In accordance with the preferred embodiments as mention above, it can berealized that one of the advantages is to form the spacer walls. Theformation of the spacer walls can precisely decide the position of thesealant, further, the dimension of the device could be controlled.Therefore, the gross dies, which perform a scribing process for a wafer,will be improved. Besides, precisely controlling the height of thespacer walls will control the gap between the semiconductor wafer andthe transparent substrate and the stability of the sealant. Furthermore,a scribing process is performed after the semiconductor wafer and thetransparent substrate is adhered, hence, the throughput is enhanced.

The preferred embodiments are only used to illustrate the presentinvention, not intended to limit the scope thereof. Many modificationsof the preferred embodiments can be made without departing from thespirit of the present invention.

1. A method for a wafer level packaging, comprising: providing asemiconductor wafer, wherein said semiconductor wafer comprisespluralities of dies thereon; depositing a dielectric layer on saidsemiconductor wafer and said pluralities of dies are covered; removing aportion of said dielectric layer in order to form pluralities of spacerwalls on said pluralities of dies; forming pluralities of sealantadjoining on a side wall of said pluralities of spacer walls; covering atransparent substrate on said semiconductor wafer; and dicing saidsemiconductor wafer covered by said transparent substrate into saidpluralities of dies individually.
 2. The method for a wafer levelpackaging according to claim 1, wherein each of said pluralities of diescomprises a photosensitive zone.
 3. The method for a wafer levelpackaging according to claim 1, wherein a step for removing saiddielectric layer comprises exposing a photosensitive zone.
 4. The methodfor a wafer level packaging according to claim 3, wherein saidphotosensitive zone further comprises surrounding by four of saidpluralities of spacer walls.
 5. The method for a wafer level packagingaccording to claim 1, wherein said side wall is an inner side wall. 6.The method for a wafer level packaging according to claim 1, whereinsaid side wall is a outer side wall.
 7. The method for a wafer levelpackaging according to claim 1, wherein a material of said transparentsubstrate is quartz.
 8. A method for a wafer level packaging,comprising: providing a semiconductor wafer and a transparent substrate,wherein said semiconductor wafer comprises pluralities of dies thereon;depositing a dielectric layer on said transparent substrate; depositinga photoresist layer on said dielectric layer; removing a portion of saidphotoresist layer in order to expose a portion of said dielectric layer;removing a portion of said exposed dielectric layer, utilizing saidphotoresist layer as a mask in order to form pluralities of spacer wallson said transparent substrate; forming pluralities of sealant adjoininga side wall of said pluralities of spacer walls; covering saidsemiconductor wafer on said transparent substrate; and dicing saidsemiconductor wafer covered by said transparent substrate into saidpluralities of dies individually.
 9. The method for a wafer levelpackaging according to claim 8, wherein a step for removing said portionof said exposed dielectric layer comprises utilizing said pluralities ofdies of said semiconductor wafer as a referable pattern.
 10. The methodfor a wafer level packaging according to claim 8, wherein said side wallis an inner side wall.
 11. The method for a wafer level packagingaccording to claim 8, wherein said side wall is an outer side wall. 12.The method for a wafer level packaging according to claim 8, whereineach of said pluralities of dies comprises a photosensitive zone.